Build-vs-Buy Economics for On-Site UPW Generation in Advanced Packaging: A Shanghai ChiMay Briefing
Advanced semiconductor packaging — 2.5D and 3D integration, fan-out wafer-level packaging, hybrid bonding — has become one of the fastest-growing demand segments for ultrapure water (UPW). Packaging facilities historically bought finished UPW from external utilities or shared infrastructure. As volumes and quality demands have climbed, the build-versus-buy question has reopened, and it is now a…
